焦磷酸盐低锡青铜合金电镀工艺及辅助配位剂的功能  

Process for Cu-Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent

作　　者：冯绍彬[1] 苏畅[1] 程苏[1] 李会东[1] 

机构地区：[1]郑州轻工业学院材料与化学工程学院,河南郑州450002

出　　处：《材料保护》2011年第8期34-37,89,共4页Materials Protection

基　　金：国家自然科学基金项目(20576126);郑州市科技攻关项目(083SGYG23143-7)

摘　　要：为了提高焦磷酸铜-焦磷酸亚锡电镀低锡青铜合金工艺的性能,在其镀液中加入辅助配位剂柠檬酸盐。用电化学、X射线衍射、腐蚀膏试验等方法对镀液及镀层性能进行分析。结果表明:合金镀液具有良好的分散能力,可在较宽的电流密度范围内获得色泽一致、锡含量约为10%的低锡合金镀层;电镀初始过程可实现钢铁表面的电位活化,提高了镀层与铁基体的结合强度;镀层结晶良好;合金镀层与铜镀层、暗镍镀层相比具有更好的抗腐蚀性能;Cu-Sn合金/亮镍/装饰铬复合镀层具有良好的防护-装饰效果。该工艺具有较好的稳定性能,是实现节镍、代镍的较理想工艺。Citrates as auxiliary complexing agent were introduced into the bath composed of pyrophosphate and stannous pyrophosphate for Cu-Sn alloy electroplating, and the properties of the plating bath and alloy coating were analyzed based on electrochemical measurement, X-ray diffraction analysis and corrosion paste test. Results show that the eiectroplating bath has good throwing power and can be well used to prepare uniform Cu-Sn alloy coating containing 10% Sn in a wide range of electric current density. The iron and steel surface was activated during the early stage of electroplating, which contributed to increasing adhesion of the alloy coating to substrate. The coating had good crystallinity and better corrosion resistance than electroplated Cu coating and dark Ni coating. Besides, as-deposited CuSn alloy coating could be well applicable to decorative Cr coating. This process had good stability, and could realize Nisaving and Nireplacing.

关 键 词：铜锡合金电镀 焦磷酸体系 二价锡 辅助配位剂 抗腐蚀性 

分 类 号：TQ153.2[化学工程—电化学工业]