超高速磨削切屑去除机理的分子动力学仿真研究  

Study on mechanism for chip removal by molecular dynamics simulation in ultra-high speed grinding

作　　者：高兴军[1,2] 赵恒华[1] 邹平[2] 刘峰[1,2] 

机构地区：[1]辽宁石油化工大学机械工程学院,抚顺113001 [2]东北大学机械工程与自动化学院,沈阳110819

出　　处：《现代制造工程》2011年第8期17-21,共5页Modern Manufacturing Engineering

基　　金：国家自然科学基金项目(50570381);辽宁省自然科学基金项目(20102067);辽宁省重点实验室基金资助项目(20060276)

摘　　要：利用分子动力学建立了超高速磨削的物理模型和数学模型,模型包括边界原子层、牛顿原子层和恒温原子层。运用Tersoff势函数对磨粒原子和工件原子之间的相互作用力进行计算。建立了模拟的运动方程,对其进行数值求解,从而获得工件原子变化后的位移和速度。模拟了不同磨削深度下切屑的形成情况。讨论磨削深度对切屑形成过程的影响,研究了超高速磨削冲击成屑的机理。The physics models and mathematics models of molecular dynamics simulation in ultra-high speed grinding are built up.The models are consisted of the boundary atom,Newton＇s atom and the constant temperature atom.The interaction between the grinding grain particles and workpiece particles is computed by the Tersoff empirical potential function.The equation of motion is built up.It is solved by numerical value and the speed and displacement of these particles are obtained.Finally the motion track of them in the different depth of cutting is simulated.According to the variety regulation of surface and the variety circumstance of the removal particles,the reasonable explanation about the mechanism for chip removal of ultra-high speed grinding is given.

关 键 词：超高速磨削 分子动力学 切屑去除机理 

分 类 号：TG501.1[金属学及工艺—金属切削加工及机床]