影响镍铜合金电镀层成分的因素  

Factors affecting the composition of electroplated nickel-copper alloy coating

作　　者：王瑞永 黄中省 

机构地区：[1]福建紫金矿业集团矿冶设计研究院,福建上杭364200

出　　处：《电镀与涂饰》2011年第8期13-16,共4页Electroplating & Finishing

基　　金：国防科工委军品配套项目"二代红外探测器杜瓦用高效冷屏件的研制"基金资助(JPPT-115-2-676)

摘　　要：研究了以柠檬酸钠为配位剂的硫酸盐体系中影响镍铜合金镀层成分的因素。镀液基本组成及工艺条件为:六水合硫酸镍100g/L,五水合硫酸铜10g/L,柠檬酸钠70g/L,硼酸30g/L,氯化钠6g/L,温度55°C,pH4.5,电流密度3A/dm2。结果表明:镀层中铜含量随主盐硫酸铜和配位剂柠檬酸钠含量的增大而增加,随电流密度和pH的增大而减少。单独加入丁炔二醇或糖精,可使镀层中铜含量升高,加入明胶则镀层铜含量下降。The factors affecting the composition of Ni-Cu alloy electroplated from a sulfate bath with sodium citrate as complexing agent were studied. The bath composition and process conditions are as follows：NiSO4·6H2O 100 g/L,CuSO4·5H2O 10 g/L,sodium citrate 70 g/L,H3BO3 30 g/L,NaCl 6 g/L,temperature 55 °C,pH 4.5,and current density 3 A/dm2. The results showed that the Cu content of Ni-Cu alloy deposit is increased with increasing CuSO4 and sodium citrate contents in bath or by the addition of butynediol or saccharin,but decreased with increasing current density and pH or by the addition of gelatin.

关 键 词：镍铜合金 电镀 化学成分 添加剂 

分 类 号：TQ153.2[化学工程—电化学工业]