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作 者:李新跃[1] 曾宪光[1] 郑兴文[1] 梁伟[1]
机构地区:[1]四川理工学院材料与化学工程学院,四川自贡643000
出 处:《电镀与精饰》2011年第8期38-42,共5页Plating & Finishing
摘 要:采用单因素试验和正交试验研究了温度、pH、柠檬酸钠和次磷酸钠质量浓度等工艺条件对化学镀Ni-P合金镀层耐蚀性的影响,得到了一种沉积速率较快,耐蚀性能好的化学镀Ni-P合金工艺。结果表明,最佳工艺条件为:25g/L硫酸镍,24 g/L次磷酸钠,45 g/L柠檬酸钠,2mg/L硫脲,0.1 g/L乙酸钠,0.5mL/L OP-10,pH为8,t为50min,θ为70℃。在该工艺条件下,镀层沉积速率为20 g/(m2.h),镀层厚度可达19μm,镀层硬度为528.25HV,镀层表面十分均匀,镀层具有较好的耐蚀性和结合力。The effect of temperature, pH value, content of sodium citrate and sodium hypophosphite on the corrosion resistance of Ni-P electroless coating on aluminum alloy was investigated by using single factor and orthogonal methods. A suitable electroless Ni-P alloy plating condition with higher deposition rate and corrosion resistance was obtained. The results show that the optimal processing parameters are NiSO4 · 6H2O 25g/L, NaH2PO2 · H2O 24g/L, C6HsNa3O7 ·2H2O 45g/L, CH4N2S 2mg/L, CH3COONa · 3H2O 0.1 g/L, OP-10 0.5mL/L, pH value of 8.0, processing time of 50 min, temperature of 70℃. Under this condition, the plating rate of Ni-P coating reaches to 20 g/( m^2 · h) , and the coating has a uniform surface, higher corrosion resistance and better adhesion with the thickness of 19μm and hardness of 528.25 HV.
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