湿法缠绕用环氧配方适用期研究  

Pot Life of Epoxy Formula for Wet Winding

作　　者：王斌[1] 杨建奎[1] 方东红[1] 吴斌[1] 

机构地区：[1]中国航天科技集团公司四院四十三所,西安710025

出　　处：《固体火箭技术》1999年第4期61-65,共5页Journal of Solid Rocket Technology

摘　　要：用DSC、IR、GPC等测试技术对芳纶纤维湿法缠绕复合材料用环氧配方在贮存过程中的粘度、固化度、固化动力学参数以及分子量及其分布特征进行了研究，研究结果表明，HR18环氧配方的室温适用期较长且随存放温度升高而变短，在较低的温度条件下可延长树脂系统的使用寿命。Viscosity, curing degree, curing dynamic parameter, molecular weight and its distribution ofHR18 epoxy formula for aramid fibre wet winding in its storage process are investigated by uslng moderninstrumental analysis, such as differential scanning calormetry (DSC), infrared spectrometry (IR) andgel permeation chromatography (GPC) etc. Results show that the pot life of HR18 epoxy formula atroom temperature is longer and can become shorter with keeping in reserve at higher temperature,therefore pot life of this resin system storaged at lower temperature can be prolonged effectively.

关 键 词：粘接剂 环氧基复合材料 湿法缠绕 适用期 

分 类 号：TB332[一般工业技术—材料科学与工程]