金纳米粒子通过形成Au-S键的组装  

Covalent Attachment of Gold Nanoparticles onto the Thiol terminated Surface through Au-S Bonding

作　　者：胡瑞省[1] 刘善堂[1] 朱涛[1] 刘忠范[1] 黄小华[1] 黄惠忠[1] 

机构地区：[1]北京大学化学学院,纳米科技中心北京100871

出　　处：《物理化学学报》1999年第11期961-965,共5页Acta Physico-Chimica Sinica

基　　金：国家自然科学基金!资助项目(29803002)

摘　　要：利用湿化学法以纳米粒子为基本单元构筑各种纳米复合结构，具有灵活简便、通用性强等特点，近年来受到了广泛的重视．Ｎａｔａｎ［１-４］等最先开展了在固体表面上制备金纳米粒子单层膜的研究，他们借助双官能团硅烷化试剂对硅氧化物基底（如玻璃、石英等）进行表面修饰?..Gold nanoparticles were covalently attached to the thiol terminated surface,which was created by aqueous silanization of the single crystal silicon substrate with 3 mercaptopropyl trimethyl silane(3 MPTMS).This paper reports the first evidence for Au-S bonding between the gold particles and the surface thiol groups given by the angle resolved XPS measurements.

关 键 词：金纳米粒子 金硫键 巯基 组装 

分 类 号：O614.123[理学—无机化学]