FGH95-K418B双合金热等静压复合工艺研究  

FGH95-K418B Dual Alloy HIP Diffusion Bonding Process

作　　者：罗学军[1] 马国君[1] 王晓峰[1] 田高峰[1] 盖其东[1] 穆松林[1] 

机构地区：[1]北京航空材料研究院先进高温结构材料重点实验室,北京100095

出　　处：《航空材料学报》2011年第4期29-32,共4页Journal of Aeronautical Materials

基　　金：重点实验室基金资助项目(9140C4303021004)

摘　　要：采用热等静压扩散连接工艺实现了FGH95高温合金粉末和K418B铸造合金之间的可靠连接。研究了热等静压复合连接工艺对FGH95-K418B复合界面的成分扩散、界面组织的影响,以及对叶片材料组织和性能的影响。结果表明,通过合理的工艺选择与改进,可以在保证对偶材料性能满足要求的前提下实现界面的良好扩散与结合。The development of HIP diffusion bonding of P/M superalloy FGH95 powder and K418B cast blade materials has been explored.The effects of HIP bonding process on elements diffusion and precipitation at FGH95-K418B interface were discussed.The variations of microstructure and mechanical properties of K418B cast blade materials after hipping have also been investigated.The results show that the perfect diffusion and bonding at powder-blade materials interface can be achieved by proper control,and the properties of K418B materials can also be maintained up to the desired level after HIP diffusion bonding.

关 键 词：双合金 整体叶盘 热等静压 扩散连接 

分 类 号：V223[航空宇航科学与技术—飞行器设计] V215.5