放电等离子烧结钼和钨基体上(1-x)Ti_3SiC_2+xSiC层状复合材料的显微组织  

Microstructure of Molybdenum and Tungsten Matrix(1-x) Ti_3SiC_2+xSiC Layered Composites Prepared by Spark Plasma Sintering

作　　者：谭文昌[1] 郑军君[1] 罗汇果[1] 胡昌旭[1] 倪东惠[1] 

机构地区：[1]华南理工大学国家金属材料近净成形工程技术研究中心,广州510640

出　　处：《机械工程材料》2011年第8期48-50,54,共4页Materials For Mechanical Engineering

基　　金：国家自然科学基金资助项目(5070560);广东省自然科学基金资助项目(8151064101000029);国家重点基础研究"973"计划专项课题(2007CB616905)

摘　　要：以元素粉体为原料,采用分层布粉和放电等离子烧结技术制备了钼基体和钨基体上的(1-x)Ti_3SiC_2+xSiC(x=0,0.1,0.2)层状复合材料,并对其各层及界面显微组织进行分析。结果表明:经1 300℃烧结后,层状复合材料中钼层与Ti_3SiC_2层以及钨层与Ti_3SiC_2层都有明显的过渡层生成,而且过渡层界面都较平直和清晰,界面处没有明显的缺陷,界面结合紧密,钼层和Ti_3SiC_2层的过渡层约有80μm厚,钨层和Ti_3SiC_2层的过渡层则达到50μm;烧结后得到致密的钼层,而钨层则孔洞较多。The molybdenum and tungsten matrix layered composites were prepared by stepwise laying of elemental powders and spark plasma sintering technology, and the microstructure of their interface was analyzed. The results show that the obvious transition layers were built in the interfaces between molybdenum layer and Ti3SiC2 layer, tungsten layer and Ti3SiC2 layer in layered composite after sintering at 1 300℃, and the interface of the transition layer was straight, clear and tight, and obvious defection had not observed. The thickness of the transition layer between molybdenum layer and Ti3SiC2 layer, tungsten layer and Ti3SiC2 layer were about 80, 50μm respectively. After sintering at 1 300℃, compact molybdenum layer was obtained and tungsten layer contained more pores.

关 键 词：层状复合材料 TI3SIC2 SiC放电等离子烧结 

分 类 号：TG148[一般工业技术—材料科学与工程]