用断裂法检验奥氏体不锈钢粉末渗硅层与基体的结合  

Breaking Test for the Combination of Pack Siliconized Layer with Substrate of Austenitic Stainless Steel

作　　者：罗新民[1] 王金兰[1] 陈康敏[1] 潘励[1] 

机构地区：[1]江苏大学材料科学与工程学院,江苏镇江212013

出　　处：《热处理》2011年第4期23-26,共4页Heat Treatment

摘　　要：采用固体粉末渗硅法对304奥氏体不锈钢进行了渗硅处理,用预制缺口断裂法考察了渗层与基体的结合情况,采用显微硬度试验、SEM和EDS等方法分析了渗硅层断裂形貌与微观结构的关系。断口结合强度试验结果表明,渗硅层与钢基体结合良好,渗硅层均匀的柱状晶结构、硅含量的梯度分布、渗层与基体显微硬度的过渡匹配以及渗层前沿的纳米晶结构均有利于加强渗层与基体的结合。AISI304 austenitic stainless steel was pack siliconized.Breaking test was conducted by the notched specimen to investigate the combination of siliconized layer with substrate.The relation of the fracture morphology to the microstructure of siliconized layer was analyzed by means of hardness test,SEM and EDS.The results of the breaking test revealed that the siliconized layer was well combined with the substrate.The fine compact columnar grain structure,graded distribution of silicon concentration,transition match of microhardness from the case to the substrate and nano-scale frontier of siliconized layer would be beneficial to strengthening the combination of case with substrate.

关 键 词：奥氏体不锈钢 粉末渗硅 结合强度 缺口断裂试验 断口分析 

分 类 号：TG156.83[金属学及工艺—热处理]