二元改性聚氨酯耐热胶粘剂的研制  

Preparation of binary modified polyurethane heat-resistant adhesive

作　　者：殷锦捷[1] 周华利[1] 薛晨[1] 陈作君[1] 

机构地区：[1]辽宁工程技术大学材料科学与工程学院,阜新123000

出　　处：《化工新型材料》2011年第8期112-114,共3页New Chemical Materials

摘　　要：通过单因素实验和正交实验,以胶粘剂对基材(丁苯橡胶-丁苯橡胶)的剪切强度为依据,确定了用氨基硅油和环氧树脂改性聚氨酯胶粘剂时,制备聚氨酯预聚体的单体甲苯二异氰酸酯(TDI)和聚醚二元醇(DL2000)的恰当配比,氨基硅油和环氧树脂的恰当添加量,以及恰当的反应时间和反应温度。通过热分析技术(TG-DSC),对比分析了未改性胶粘剂和二元改性胶粘剂的热性能;最后对比检测了未改性胶粘剂和二元改性胶粘剂对不同基材的剪切强度以及自身的各种性能。实验结果表明:二元改性聚氨酯胶粘剂对各种基材具有较高的粘接强度,其自身具有良好的附着力、较低的吸水率、较好的热稳定性和耐酸碱性能。By single factor experiment and the orthogonal experiment, organosilicon and epoxy resin modified poly- urethane adhesive was prepared. According to the shear strength of adhesive on base material （styrenebutadiene rubber -- styrenebutadiene rubber）, the optimum ratio of TDI and DL2000 of polyurethane was determined, appropriate additive quantities for organosilicon and epoxy resin were obtained, included suitable reaction time and reaction temperature. Through the. thermal analysis technology, comparative analysis was executed for the thermal performance of unmodified ad- hesive and binary modified adhesive. Contrast test of the unmodified adhesive and dual adhesive backing was took for different materials＇s shear strength as well as own various performance at last. The result showed that organosilicon and epoxy resin modified polyurethane adhesive had high bonding strength and adhesion force, low water adsorption rate, high thermal stability and corrosive acid and base resistance.

关 键 词：聚氨酯胶粘剂 有机硅 环氧树脂 二元改性 

分 类 号：TQ433.432[化学工程]