低银无铅焊料的研制动态  

Development status of low-Ag lead free solders

作　　者：刘平[1,2] 顾小龙 赵新兵[2] 刘晓刚 

机构地区：[1]浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,浙江杭州310011 [2]浙江大学材料科学与工程学系,浙江杭州310027

出　　处：《电子元件与材料》2011年第9期82-85,共4页Electronic Components And Materials

基　　金：浙江省2010年自然科学基金资助项目(No.Y4100809)

摘　　要：分析了低银无铅焊料(w(Ag)≤1.0%)在成本、抗跌落性能、Ag3Sn化合物的形成等方面与高银焊料相比的优势,综述了低银焊料在应用过程中面临的问题,如高熔点与氧化、热疲劳性能、返修缺陷等,并列举了实例,提出了一些有针对性的解决方案。最后展望了低银无铅焊料的发展趋势。The advantages of low-Ag lead free solders （w（Ag）≤1.0%） are analyzed from aspects of cost, amti-dropping capability, and Ag3Sn forming in the solder bulk by comparing to those of high-Ag lead free solders. Some problems of low-Ag lead free solders in application, such as high melting point, thermal fatigue property, rework defects, are summarized, and some solutions are presented. Finally, the prospects of low-Ag lead free solders are proposed.

关 键 词：低银无铅焊料 性能 综述 研制 

分 类 号：TN306[电子电信—物理电子学]