纳米SiO_2改性EP/BMI/CE树脂体系固化动力学研究  

Study on curing kinetics of EP/BMI/CE resin system modified by nano-SiO_2

作　　者：吴广磊[1] 寇开昌[1] 晁敏[1] 卓龙海[1] 蒋洋[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国胶粘剂》2011年第8期1-4,共4页China Adhesives

基　　金：西北工业大学2011年度研究生创业种子基金(Z2011010)

摘　　要：采用非等温差示扫描量热(DSC)法对纳米二氧化硅/环氧树脂/双马来酰亚胺/氰酸酯(nano-SiO2/EP/BMI/CE)树脂进行了固化反应动力学和固化工艺研究。通过Kissinger法和Ozawa法求得了nano-SiO2/EP/BMI/CE树脂体系固化反应动力学的表观活化能。结果表明:改性CE树脂体系的固化工艺参数为凝胶温度112℃、固化温度195℃及后处理温度213℃,进而确定了改性CE树脂体系的最佳固化工艺条件为"150℃/3 h→180℃/3 h→200℃/2 h";改性CE树脂体系的平均表观活化能为59.90 kJ/mol。The curing reaction kinetics and curing process for an EP（epoxy resin）/BMI（bismaleimide）/CE（cyanate ester）resin modified by nano-SiO2 were investigated by non-isothermal differential scanning calorimetry（DSC）. The apparent activation energy of curing reaction kinetics for nano-SiOJEP/BMI/CE resin was calculated by Kissinger method and Ozawa method. The results showed that the curing process parameters（such as the gelling temperature at 112 ℃,curing temperature at 195 ℃ and post-treatment temperature at 213 ℃） of modified CE resin system were obtained, and the optimal curing process conditions of modified CE resin system were ascertained for ＂150 ℃/3 h→180℃/3 h →200 ℃/2 h＂. The average apparent activation energy of modified CE resin system was 59.90 kJ/mol.

关 键 词：纳米二氧化硅 氰酸酯树脂 环氧树脂 双马来酰亚胺树脂 固化动力学 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]