LCP基板制作工艺及其在微波无源电路中的应用  

Manufacturing Process of LCP Substrates and Its Applicaiton in Microwave Passive Circuits

作　　者：孙兆鹏[1] 严伟[1] 王列松[1] 

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2011年第4期46-48,52,共4页Electro-Mechanical Engineering

摘　　要：液晶聚合物(LCP)基板是继低温共烧陶瓷(LTCC)后的新一代微波毫米波基板材料,具有损耗小、成本低、使用频率范围大、强度高、重量轻等许多独特的优点。文中详细介绍了LCP制作工艺,对基于LCP基板的微波平面传输线的性能进行了分析,并设计出两层基板的X波段21dB耦合器,为基于LCP多层基板的微波无源电路研制打下基础。Liquid crystal polymer（LCP） substrate is a new generation of substrate material for microwave and millimeter-wave application after LTCC.LCP substrate features low loss,low cost,large range of frequency,high strength and light weight,etc.In this paper,the manufacturing process of LCP substrate is described in detail.The performance of coplanar transmission line based on LCP substrate is analyzed.A 21dB coupler with two layers of substrate is designed,its frequency is at X band.It lays the foundation for the research of microwave passive circuits based on LCP multi-layer substrate.

关 键 词：液晶聚合物 介电常数 耦合器 微波无源电路 

分 类 号：TN405[电子电信—微电子学与固体电子学]