Cu含量对Al-Cu合金定向凝固组织及一次枝晶间距影响  

Effects of Cu Content on Microstructure of Directional Solidification of Al-Cu Alloy and Primary Dendritic Spacing

作　　者：崔联合[1] 庞敬礼[1] 李达云[2] 

机构地区：[1]江阴职业技术学院,江苏江阴214405 [2]梅特勒-托利多(常州)精密仪器有限公司,江苏常州213022

出　　处：《热加工工艺》2011年第15期34-37,共4页Hot Working Technology

摘　　要：选用Al-Cu合金进行定向凝固试验,对不同铜含量的Al-Cu合金一次枝晶微观组织形貌进行分析,并测定了一次枝晶间距。实验结果表明:在铜含量较低时,适当增加铜含量能促进枝晶生长的规整性;当含铜量为1.77%时,定向凝固组织并不明显。随着含铜量的增加,可观察到较为细小的一次枝晶组织,一次枝干呈平行生长趋势,且枝干间距较均匀,二次枝晶呈点状分布在一次枝干上。当试样铜含量从1.77%增加到3.00%时,一次枝晶间距逐步增大,但枝晶间距增加幅度较小;当铜含量较小时,试样铜含量对枝晶间距的影响不明显。The directional solidification experiments of Al-Cu alloys were done,the microstructures of primary dendritic of Al-Cu alloys with different Cu content were analyzed and the primary dendritic spacing were determined.The results show that when the content of copper is lower,the regularity of dendritic growth is promoted by increasing Cu content properly.When the content of copper is 1.77%,the microstructure of directional solidification is not obvious.With the increase of the content of copper,the thinner primary dendritic can be seen and the primary branches grow parallelly and the intervals between them are symmetrical.The secondary arms distribute on the primary branch in spotted state.When the content of copper increases from 1.77% to 3.00%,the primary dendritic spacing gradually presents enlarging tendency,but the adding argument is not great.If the copper is not higher,its impact on the dendritic spacing is not very great.

关 键 词：定向凝固 一次枝晶间距 AL-CU合金 微观组织 

分 类 号：TG113[金属学及工艺—物理冶金] TG244[金属学及工艺—金属学]