轧制压下率对Cu/Al层状复合材料界面扩散层生长的影响  

Effects of Different Rolling Reduction on Growth Rate of Interface Diffusion Layer of Cu/Al Cladding Strip

作　　者：张迎晖[1] 王达[1] 赵鸿金[1] 张明明[1] 李志余[1] 

机构地区：[1]江西理工大学材料与化学工程学院

出　　处：《特种铸造及有色合金》2011年第6期561-564,共4页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(50964006)

摘　　要：采用金相显微镜、SEM及EDS等分析手段对Cu/Al冷轧复合界面结合机理进行研究,建立扩散退火阶段不同轧制压下率时的扩散层生长动力学方程,并探讨了不同压下率对界面扩散层生长的影响。结果表明,轧制复合阶段界面形成激活中心数量随压下率的升高而增加,当压下率为75%时达到峰值。另外,压下率在退火温度较高时对扩散层生长影响显著。Bonding mechanism of cold rolling Cu cladding Al Compound was analyzed by OM （optical microscope） and SEM （scanning electron microscope） as well as EDS （energy dispersive spectrometer）. Growth dynamic equation of diffusion layer of the interface at different rolling reduction with annealing treatment was established to understand effects of different reduction on growth rate of diffusion layer. The results show that with increasing in reduction, numbers of activated center formed at the interface are increased during rolling compound, and maximum value can be observed with 75% reduction. In addition, in the condition of the higher annealing temperature, reduction is greatly related to the growth rate of diffusion layer.

关 键 词：Cu/Al复合材料 轧制压下率 界面反应 生长动力学 

分 类 号：TB331[一般工业技术—材料科学与工程]