硅基热沉大功率LED封装阵列散热分析  

Thermal Analysis on High-power LED Package Array of Si-based Heatsink

作　　者：张靖[1] 钟冬梅[2] 王培界[1] 王品红[1] 

机构地区：[1]重庆光电技术研究所,重庆400060 [2]重庆邮电大学光电工程学院,重庆400065

出　　处：《半导体光电》2011年第4期495-497,520,共4页Semiconductor Optoelectronics

摘　　要：为求解硅基热沉大功率LED封装阵列在典型工作模式下的热传导情况,采用Solidworks建立了2×2封装阵列的三维模型,模拟了其温度场分布,同时结合传热学基本原理分析计算了模型各部分的温度值,并对实际工艺制备出的封装器件的结温进行了测量。结果表明,理论计算值与热仿真结果基本一致,测量值也能很好地与理论计算值相吻合。A 3D model of a 2 × 2 LED array with Si-based heatsink was established by using Solidworks. The temperature field distribution of the package array was simulated, and the temperature of each part was calculated based on analyzing the basic principles of heat conduction. According to the simulation results, an LED array was fabricated, and its junction temperature was measured. Values of both the thermal simulation and practical measurement agree well with the theoretically calculated results.

关 键 词：大功率LED 热传导 热分析 SOLIDWORKS 

分 类 号：TN312.8[电子电信—物理电子学]