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作 者:谢德华[1,2] 施周[1] 冯华洋[1] 陈世洋[1] 宋勇[1]
机构地区:[1]湖南大学土木工程学院,长沙410082 [2]湖南科技大学土木工程学院,湘潭411201
出 处:《膜科学与技术》2011年第4期31-35,共5页Membrane Science and Technology
基 金:国家自然科学基金项目(50778065)
摘 要:基于Donnan dialysis原理,在无外加电压作用下采用阳离子交换膜分离去除原水中的Cu2+,研究pH对阳离子交换膜分离去除Cu2+效果的影响.研究结果表明:原水及补偿离子溶液pH≥4时,H+浓度较低,其对阳离子交换膜分离去除Cu2+无明显影响,去除率均在85%左右;原水pH=3时,阳离子交换膜分离去除Cu2+的能力降低,去除率为60%~62%左右;原水pH=6,补偿离子溶液pH=3时,H+与补偿离子K+具有累加作用,但累加作用不明显,Cu2+去除率只有少量增加.Based on Donnan dialysis theory, the effect of pH on copper ion removal is investigated when the cation exchange membrane is applied to remove copper ion without external power input. The following results are obtained: the concentration of hydrogen ion is low and has no obvious effect on the removal rate, which was about 85%, when pH of raw water and the compensation ion solution is pH≥4; the capacity of the cation exchange membrane to remove Cu2 + decreases when pH of raw water is 3, and the removal rate is about 60%-62% hydrogen ions and the compensation potassium ions have cumulative effect but it is not obvious,when pH of raw water is 6 and pH of the compensation ion solution is 3, and the removal rate of Cu^2 + has only a small increase.
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