高功率半导体激光器微通道热沉的方案设计  

Design of micro-channel heat sink for high power laser diode

作　　者：刘刚[1] 唐晓军[1] 王超[1] 刘磊[1] 梁兴波[1] 徐鎏婧[1] 杜涛[1] 陈三斌[1] 刘洋[1] 

机构地区：[1]固体激光技术国家重点实验室,北京100015

出　　处：《强激光与粒子束》2011年第8期2057-2061,共5页High Power Laser and Particle Beams

基　　金：国防科技基础研究基金项目

摘　　要：对用于高功率半导体激光器的叠片式微通道热沉进行方案设计,利用计算流体力学和数值传热学对各种方案进行数值仿真,研究了微通道的特征尺寸和流量等因素对冷却效果和流动阻力特性的影响,一般情况下,减小微通道的特征尺寸和增加冷却水的流量可以降低传热热阻,但增加了流动压力损失;另外对金刚石热扩散片(次热沉)的效果也进行了数值计算,计算结果表明:金刚石热扩散片在该类型问题中降低温度作用明显。Water cooling micro-channel heat sink for high power laser diode was designed. And designs were simulated with computational fluid dynamics（CFD） and numerical heat transfer（NHT） methods. Influences of the size, number of cooling channels and flow rate of cooling water to temperature level and flow resistance characters of the heat sink were discussed. The per formance with a diamond heat spreader was numerical calculated. The results indicate that diamond heat spreader can play an important role on decreasing temperature of the heat sink.

关 键 词：半导体激光器 热沉 微通道 热流密度 计算流体力学 

分 类 号：TN248[电子电信—物理电子学]