喷射电铸工艺参数对铜铸层形貌的影响  

Effects of Processing Parameters in Jet Electroforming on Microstructure of Copper Electroforming Layer

作　　者：陈劲松[1] 田宗军[2] 刘志东[2] 赵阳培[2] 

机构地区：[1]淮海工学院.江苏连云港222005 [2]南京航空航天大学,江苏南京210016

出　　处：《材料科学与工程学报》2011年第4期513-516,共4页Journal of Materials Science and Engineering

基　　金：国家自然科学基金资助项目(50575104);淮海工学院自然科学基金项目(Z2009003),淮海工学院人才引进启动基金资助项目

摘　　要：介绍了喷射电铸的相关原理,运用扫描电镜分析了相关工艺参数(电流密度、电解液喷射速度、扫描速度、扫描层数)对铜沉积层微观结构的影响,采用工艺参数:电流密度300A/dm2,电解液喷射速度4m/s,喷嘴扫描速度10mm/s制备了纳米铜块体。结果表明喷射电铸可大大提高电铸的电流密度,远高于传统电铸电流密度;电流密度、喷射速度、扫描速度以及扫描层数都对沉积层的表面生长形态有较大的影响,使用低电流密度、高喷射速度和快的扫描速度和少的扫描层数有利于获得平整、致密的沉积层。Related principles of jet electroforming were introduced,which was used to prepare bulk copper.The influences of the main experimental parameters,such as current density,electrolyte jet velocity,scanning velocity and scanning number,on the microstructure of copper electrodeposition layer were studies using scanning electron microscopy.Nanocrystalline bulk copper was fabricated using the optimum processing parameters with current density of 300A/dm2,jet velocity of 4m/s and scanning velocity of 10mm/s.The results show that the current density used in jet electroforming is greatly higher than that in traditional electroforming.Current density,electrolyte jet velocity,scanning velocity and scanning number have great effects on the surface morphology of the deposited copper.The copper deposition with fine grains and flat surface can be got by using lower current density,high jet flow and rapid scanning speed.

关 键 词：喷射电铸 电流密度 喷射速度 扫描速度 扫描层数 

分 类 号：TG153[金属学及工艺—热处理]