微小深度尺寸现场测量系统的研究  

Research on in-situ measurement system of micro-depth dimension

作　　者：黄柳[1] 余桂英[1] 郑颖君[1] 

机构地区：[1]中国计量学院,杭州310018

出　　处：《光学技术》2011年第5期556-561,共6页Optical Technique

基　　金：浙江省重大科技专项重点工业项目(2009C11059);浙江省大学生创新创业孵化项目(2010R409053)

摘　　要：针对目前微小深度尺寸现场测量难的问题,设计开发了一种基于光切原理的现场视觉检测系统,应用自主开发的基于Directshow和VC++的图像采集和处理软件,能快速、准确地检测被测工件表面的微小深度尺寸。实验结果表明,该测量系统景深达700μm,可测量20～990μm的深度尺寸,系统整体的测量不确定度优于3%;在200～500μm范围内,系统测量误差小于1.5μm,测量不确定度优于1%。通过模拟易开盖生产现场的振动环境(振动频率为6.7Hz,位移振幅360μm),对该测量系统振动适应性做了分析,实验验证了本系统能够用于类似易开盖生产现场的加工环境中。According to the difficult problem of measuring micro-depth dimension in industrial production site, an insitu vision inspection system based on light-section principle is developed, which applies image acquiring and processing software based on Directshow and VC＋ ＋ to measure micro-depth dimension automatically, quickly. Experimental resuits show that the depth of field in the system is 700vtm and the measuring range is from 20 to 990μm, with the measurement uncertainty of better than 3%, and at the range of 200 to 500μm, the measurement error is less than 1. 5μm, and measurement uncertainty is better than 1%. The vibration characteristics of the system is tested by using shaking table with vibration frequency of 6.7Hz and amplitude of 360μm to simulate production environment of easy open end, which verifies the system can work in similar production environments.

关 键 词：微小深度尺寸 现场测量 光切显微成像系统 景深 

分 类 号：TH741[机械工程—光学工程]