络合剂对铝基化学镀Ni-Cu-P合金性能的影响  

The effect of complexing agents on the electroless Ni-Cu-P ternary alloys plating on aluminium

作　　者：王锦[1] 李东红[1] 仓向辉[1] 张明惠[1] 

机构地区：[1]中国铝业股份有限公司郑州研究院,河南郑州450041

出　　处：《轻金属》2011年第8期68-71,共4页Light Metals

摘　　要：本试验研究了酒石酸钾钠对铝基化学镀Ni-Cu-P合金性能的影响。结果表明,镀层沉积速率、镀层显微硬度及耐腐蚀性能均随酒石酸钾钠含量的增加先增大后减小;酒石酸钾钠最佳质量浓度为10g/L时,沉积速率高达1.78×10-3 g/(cm2.h),显微硬度为415HV,自腐蚀电位为-0.581V,自腐蚀电流为1.389e-6A,此时镀层综合性能最好。酒石酸钾钠浓度为10g/L时,得到的镀层光滑致密,沉积颗粒均匀,综合性能良好。成分分析可知,镀层各成分的质量分数分别为W(Ni)84.01%,W(Cu)4.71%,W(P)11.28%。In this paper,the effect of complexing agents on the properties of the electroless Ni-Cu-P ternary alloys was researched.The experimental results indicated that in the process of electroless Ni-Cu-P ternary alloys,the plating rate,coating hardness and corrosion resistance will be increased and then decreased with increasing the content of sodium potassium tartrate.The optimal concentration of sodium potassium tartrate is 10g/l.On this condition,the deposition rate is 1.78×10-3 g/（cm2·h）,microhardness is 411.1HV,The corrosion-self voltage and corrosion-self current of coatings in 5%NaCl solution are-0.581V and 1.389e-6A.The deposits is smooth,compact,and uniform particle shape.The analyses of energy disperse X-ray indicated that the deposit contains W（Ni）=84.01%,W（Cu）=4.71% and W（P）=11.28%.

关 键 词：化学镀 NI-CU-P合金 络合剂 性能 

分 类 号：TG174.44[金属学及工艺—金属表面处理]