Al基体表面熔盐化学法镀Pb工艺  

Electroless Pb plating on Al substrate in molten salt

作　　者：蒋良兴[1] 郝科涛[1] 吕晓军[1] 赖延清[1] 洪波[1] 李渊[1] 李劼[1] 刘业翔[1] 

机构地区：[1]中南大学冶金科学与工程学院,长沙410083

出　　处：《中国有色金属学报》2011年第8期1997-2002,共6页The Chinese Journal of Nonferrous Metals

基　　金：湖南省院士基金资助项目(06FJ4059)

摘　　要：采用熔盐化学法在Al基体表面直接镀制Pb及其合金,并对其工艺条件进行优化。结果表明:熔体过热度对镀层与基体结合力的影响程度较基体浸入时间的大。随着过热度的升高,结合强度先迅速增大,在60℃之后变化不明显。在熔盐过热度为60℃,基体浸入时间2.5 min时,镀层与基体具有较好的结合强度(0.76 MPa)。往熔盐中加入适量的辅盐SnCl2可以促进Pb-Al-Sn三元合金的形成,并将镀层与基体的结合强度提高到2.1 MPa以上。在化学镀之后增加金属浴工序,可修补镀层在化学镀工序中形成的孔洞,在Al表面获得致密无孔、成分可调的Pb基合金镀层。Pb and its alloy film were prepared on the Al substrate in molten salt by electroless plating directly,and the procedure was improved.The results show that the superheat of molten salt has greater effect on the combination strength between the film and substrate than dipping time of substrate.With the increase of the superheat,the combination strength increases fast firstly.While the superheat is higher than 60 ℃,the superheat has little effect on it.The film and substrate combined well when the superheat of molten salt and the dipping time of substrate are 60 ℃ and 2.5 min,respectively.The addition of auxiliary salt SnCl2 in molten salt can promote the interdiffusion of Al,Pb and Sn on the interface,and the combination strength can exceed 2.1 MPa.The metal bath procedure after electroless plating can mend the holes of the film,and a compact and composition adjustable Pb alloy film can be obtained on Al substrate.

关 键 词：熔盐 化学镀 Al基体 Pb镀层 结合强度 金属浴 

分 类 号：TF80[冶金工程—有色金属冶金]