含碳纳米管的Sn-58Bi钎料的制备及其钎焊性  

Investigation preparation method and soldering behaviors of Sn-58Bi lead-free solder with carbon nanotubes

作　　者：何鹏[1] 安晶[2] 马鑫 陈胜 钱乙余[2] 林铁松[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]哈尔滨工业大学深圳研究生院,深圳518055 [3]亿铖达工业有限公司,深圳518101

出　　处：《焊接学报》2011年第9期9-12,113,共4页Transactions of The China Welding Institution

基　　金：中央高校基本科研业务费专项资金项目(HIT.BRET1.2010006;HIT.NSRIF.2010119);国家自然科学基金资助项目(51021002;E050803)

摘　　要：采用球磨—低温冶炼法制备了不同碳纳米管含量的Sn-58B i-CNTs钎料,借助SEM,EDS和DSC等分析手段研究了碳纳米管在钎料合金中的形态以及碳纳米管对Sn-58B i合金焊点拉脱强度的影响.结果表明,经过钎料低温冶炼后,碳纳米管能够部分加入到Sn-58B i合金中形成复合钎料;Sn-58B i-0.03%CNTs复合钎料在焊盘上的润湿性得到了提高,且微量碳纳米管的加入对钎料熔点的影响不大;碳纳米管在焊点中弥散分布使钎料的组织得到细化,并通过对焊点微观断裂机制的影响,提高焊点的可靠性.Varying weight fraction of multi-walled carbon nanotubes were incorporated into Sn-58Bi soler alloy by ball-milling and low temperature melting methods,the morphologies of carbon nanotubes in solder alloy and the influences of carbon nanotubes on the pull-off strength were investigated by SEM,EDS,and DSC.The experimental results indicate that part of carbon nanotubes are incorporated into Sn-58Bi soler alloy after ball-milling and low temperature melting;0.03% CNTs can improve the wettability;the melting point of Sn-58Bi-CNTs solder does not change much;the dispersive distribution of carbon nanotubes could refine the microstructure of Sn-58Bi-CNTs joints and the reliability of solder joints also is improved by the influences of CNTs on the fracture mechanism of solder joints.

关 键 词：碳纳米管 Sn-58Bi钎料 球磨 低温冶炼 

分 类 号：TG425[金属学及工艺—焊接]