Al-Cu-Mg-Ag耐热铝合金均匀化处理  被引量:6

Homogenization treatment of Al-Cu-Mg-Ag heat-resisted alloy

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作  者:刘晓艳[1,2] 潘清林[1] 陆智伦[1] 刘畅[1] 何运斌[1] 李文斌[1] 

机构地区:[1]中南大学材料科学与工程学院,长沙410083 [2]河北工程大学装备制造学院,河北邯郸056038

出  处:《材料科学与工艺》2011年第4期28-32,共5页Materials Science and Technology

摘  要:研究了均匀化温度和均匀化时间对Al-Cu-Mg-Ag耐热铝合金微观组织的影响,优化了合金的均匀化处理制度,并对其均匀化过程进行了动力学分析.结果表明,铸态合金组织中存在严重的枝晶偏析,晶界上有大量残留相,各元素在晶内和晶界分布不均匀.随着均匀化温度的升高或均匀化时间的延长,合金组织中的残留相逐渐溶解,晶界变得稀薄,元素分布趋于均匀.该合金过烧温度为520℃.适宜的的均匀化制度为510℃×12 h,这与均匀化动力学分析得到的结果基本相符.The effect of the homogenization temperature and time on the microstructure of Al-Cu-MgAg heat-resisted alloy was studied,the homogenization process of the alloy was also optimized,and the kinetic analysis of homogenization was carried out.The results showed that the serious dendrite microstructure existed in Al-Cu-Mg-Ag alloy ingot,and there were many residual phases in grain boundaries and the elements were unevenly distributed from grain boundary to inside.With the increasing of homogenization temperature or time,the residual phases dissolved,the grain boundaries became sparse and all elements became more homogenized.The overburn temperature of the alloy was 520℃,and the suitable homogenizing process of Al-Cu-Mg-Ag alloy was 510℃×12 h,which agreed well with the kinetic analysis of homogenization.

关 键 词:AL-CU-MG-AG合金 均匀化 显微组织 动力学方程 

分 类 号:TG146.21[一般工业技术—材料科学与工程]

 

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