高热流密度散热的多孔微热沉流动与传热实验研究  

Experimental Investigation of Flow and Heat Transfer in a Porous Micro Heat Sink for Dissipating High Heat Flux

作　　者：万忠民[1] 刘靖[1] 陈敏[1] 管琼[1] 涂正凯[2] 

机构地区：[1]湖南理工学院信息学院,湖南省岳阳市414006 [2]华中科技大学能源与动力工程学院,湖北省武汉市430074

出　　处：《中国电机工程学报》2011年第29期74-78,共5页Proceedings of the CSEE

基　　金：国家自然科学基金资助项目(50774034);湖南省自然科学基金资助项目(11JJ4032);湖南省教育厅优秀青年基金(09B041)~~

摘　　要：提出一种主动式多孔微热沉系统来实现高热流密度电子元器件封装散热的需求,分析了多孔微热沉系统的工作原理和特点。对多孔微热沉进行了高热流密度下的流动与传热实验研究,实验结果表明微热沉在高热流密度加热下能较快达到平衡;微泵驱动循环水流量为5.1cm3/s时,多孔微热沉的散热热量达到200W,散热热流高达100W/cm2,对应节点温度为55.8℃,系统压降为17.7kPa;Nu数随Re数增加而增加,Re在323时,Nu达到最大值518;随着流量以及加热热量的增加,微热沉平均换热系数增加,其最高换热系数为36.8 kW(m2℃)1。多孔微热沉系统能有效解决高热流密度电子元器件的散热问题,提高器件可靠性与使用寿命。A novel porous micro heat sink system was presented for dissipating high heat fluxes of electronic devices, and its operational principle and characteristics were analyzed. The flow and heat transfer of porous micro heat sink was investigated by experiment at the condition of high heat fluxes, and the results show that the present heat sink can reach a steady state in a short time. The heat load of 200W （heat flux of 100 W/cm2） is removed by the heat sink, and the coolant pressure drop across the heat sink system is about 17.7kPa and the heater junction temperature is 55.8℃ at the coolant flow rate of 5.1 cm3/s. Nu number of heat sink increases with the increase of Re number, and maximum value of 323 for Nu was achieved at highest Re of 518. The whole heat transfer coefficient of heat sink increases with the increase of coolant flow rate and heat load, and the maximal heat transfer coefficient is 36.8kW.（m2.℃）-1 in the experiment. The micro heat sink has good performance for electronics cooling at high heat fluxes, and it can improve the reliability and life of electronic devices.

关 键 词：多孔微热沉 多孔介质 传热 高热流密度 散热 

分 类 号：TK124[动力工程及工程热物理—工程热物理]