Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder  

作　　者：朱祥龙 康仁科 董志刚 冯光 

机构地区：[1]Key Laboratory for Precision & Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology

出　　处：《Journal of Semiconductors》2011年第10期78-85,共8页半导体学报（英文版）

基　　金：Project supported by the National High Technology Research and Development Program of China(No.2008AA042505);the National Science and Technology Key Project Program(No.2009ZX02011);the Natural Science Foundation of Guangdong Province,China (No.U0734008)

摘　　要：Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.

关 键 词：GRINDER silicon wafer surface shape control chuck dressing modeling 

分 类 号：TN305.2[电子电信—物理电子学]