硅微通道板的研究进展  

Progress in Si-microchannel plates

作　　者：黄永刚[1] 黄英[1] 张洋[1] 刘辉[1] 李国恩[1] 

机构地区：[1]中国建筑材料科学研究总院,北京100024

出　　处：《应用光学》2011年第5期960-966,共7页Journal of Applied Optics

基　　金：国家"863计划"项目资助(2006AA03A208)

摘　　要：基于微通道板(microchannel plates,MCP)高性能与绿色制造的要求,探索铅玻璃微通道板(lead silicate glass microchannel plates,LSG-MCP)的替代材料已成为MCP研究的热点。近20年来,以硅为替代材料的微通道板研究取得显著进展,并成为最具应用前景的微通道板类型之一。综述了硅微通道板(Si-MCP)的研究进展,主要概述Si-MCP的基底材料、制备技术、性能和应用领域,尤其是微孔阵列及其内壁表面功能层的成形技术。并将其与传统LSG-MCP比较,分析了Si-MCP制备技术与性能的优劣。最后,展望了Si-MCP的进一步发展方向。Based on the demands for high performance and green manufacture of microchannel plates（MCP）,the development of alternative material to replace lead silicate glass MCP（LSG-MCP） has been intensively investigated.In the past 20 years,silicon MCP has achieved significant progress and become one of the most promising MCPs.The research progress on Si-MCP is summarized in substrate material,preparation,performance and application.The preparation of microporous array,the preparation principle and method of functional layer of microporous inner wall are discussed.Compared with the conventional LSG-MCP,the advantages and disadvantages of Si-MCP in preparation and performance were analyzed.Finally,the prospect of Si-MCP is presented for further development.

关 键 词：硅微通道板(Si-MCP) 制备技术 性能参数 

分 类 号：TN223[电子电信—物理电子学] TB321[一般工业技术—材料科学与工程]