某大功率密封功放单元的热分析及优化  

Thermal analysis and optimization of the high-power sealed electronic equipment

作　　者：张丽敏[1] 朱晓凯[1] 杨爱芬[1] 

机构地区：[1]中国电子科技集团公司第二十七研究所,河南郑州450015

出　　处：《郑州轻工业学院学报（自然科学版）》2011年第4期55-58,共4页Journal of Zhengzhou University of Light Industry:Natural Science

摘　　要：以某大功率密封功放单元为例,在其结构设计的基础上,运用Icepak软件进行热分析,根据分析结果反复调整风机位置,并调整散热齿的高度为80 mm.高低温环境试验和可靠性烤机试验证实了该设计的可行性.With a high-power sealed electronic equipment as an example,the software Icepak was used to thermal analysis on the basis of structure design.According to the results of the analysis,the position of the fan was adjusted and the height of cooling tooth was adjusted to 80 mm.The machine was tested with the high-low temperature experiment and long-term stability experiment smoothly.

关 键 词：大功率密封功放单元 热设计 Icepak 

分 类 号：TK124[动力工程及工程热物理—工程热物理]