Diode Laser Soldering Technology of Fine Pitch QFP Devices  

作　　者：XUE Songbai ZHANG Liang HAN Zongjie WANG Jianxin YU Shenglin 

机构地区：[1]College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China [2]School of Mechanical and Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China [3]The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing 210013, China

出　　处：《Chinese Journal of Mechanical Engineering》2011年第5期917-922,共6页中国机械工程学报（英文版）

基　　金：supported by Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing Foundation of China (Grant No. BCXJ09-07);Jiangsu Provincial General Colleges and Universities Postgraduate Scientific Research Innovative Plan of China (Grant No. CX09B_074Z);the Six Kind Skilled Personnel Project of Jiangsu Province of China(Grant No. 06-E-020)

摘　　要：The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser soldering method with appropriate laser processing parameters,and the pitch of the QFP devices is as fine as to 0.4mm.Tensile strength of QFP micro-joints increases gradually with the increase of laser output power,the maximum tensile strength presents when the laser output power increase to a certain value.The results also indicate that the mechanical properties of QFP micro-joints soldered by diode laser soldering system are better than those of QFP micro-joints soldered by IR reflow soldering method.The experimental results may provide a theory guide for investigation of diode laser soldering.The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser soldering method with appropriate laser processing parameters,and the pitch of the QFP devices is as fine as to 0.4mm.Tensile strength of QFP micro-joints increases gradually with the increase of laser output power,the maximum tensile strength presents when the laser output power increase to a certain value.The results also indicate that the mechanical properties of QFP micro-joints soldered by diode laser soldering system are better than those of QFP micro-joints soldered by IR reflow soldering method.The experimental results may provide a theory guide for investigation of diode laser soldering.

关 键 词：diode laser soldering QFP device mechanical properties of micro-joint 

分 类 号：TN248.1[电子电信—物理电子学] U463.212[机械工程—车辆工程]