一种新型电子设备热设计分析  

Analysis on Thermal Design of a Novel Electronic Equipment

作　　者：张斌[1] 武沛勇[1] 韩凤廷[1] 

机构地区：[1]中国电子科技集团公司第五十四研究所,河北石家庄050081

出　　处：《无线电通信技术》2011年第5期41-43,共3页Radio Communications Technology

摘　　要：随着电子设备热流密度的提升,其散热设计难度越来越大。首先,从总体设计角度提出了设备的结构组成,形成了完整的设计方案;其次,通过分析需要解决的问题,确定了热设计为关键技术,并提出了设计目标;接着,介绍了整机的散热措施、分析了风机的选择过程以及风道的设计理念;最后,通过软件仿真分析、试验验证以及长期的使用,证明了该设计方案有效实用。The design of heat radiation is more and more difficult with the improvement of thermal flow density in electronic equipment. At first, the equipment composition is put forward from the point of view of general design, to form an entire design. Secondly, the heat radiation design is considered as key technology and the design goal is defined by analyzing problems to be solved. Furthermore, the heat radiation measures in whole enclosure are introduced, the blower selection and the air flow channel are analyzed. Finally, the design scheme is tested to be effective and practical by software analysis and simulation, experiments and long term running.

关 键 词：电子设备 热设计 热仿真分析 结构设计 

分 类 号：TN02[电子电信—物理电子学]