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出 处:《Chinese Physics B》2011年第10期476-479,共4页中国物理B(英文版)
基 金:supported partially by the National Basic Research Program of China (Grant No. 2010CB934204);the National Natural Science Foundation of China (Grant No. 60825403);the Director’s Fund of Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS);the National Science and Technology Major Project of China (Grant No. 2009ZX02023-005)
摘 要:In this paper, we investigate an Al2O3/HfSiO stack as the blocking layer of a metal-oxide-nitride-oxide-silicon- type (MONOS) memory capacitor. Compared with a memory capacitor with a single HfSiO layer as the blocking layer or an Al2O3/HfO2 stack as the blocking layer, the sample with the Al2O3/HfSiO stack as the blocking layer shows high program/erase (P/E) speed and good data retention characteristics. These improved performances can be explained by energy band engineering. The experimental results demonstrate that the memory device with an Al2O3/HfSiO stack as the blocking layer has great potential for further high-performance nonvolatile memory applications.In this paper, we investigate an Al2O3/HfSiO stack as the blocking layer of a metal-oxide-nitride-oxide-silicon- type (MONOS) memory capacitor. Compared with a memory capacitor with a single HfSiO layer as the blocking layer or an Al2O3/HfO2 stack as the blocking layer, the sample with the Al2O3/HfSiO stack as the blocking layer shows high program/erase (P/E) speed and good data retention characteristics. These improved performances can be explained by energy band engineering. The experimental results demonstrate that the memory device with an Al2O3/HfSiO stack as the blocking layer has great potential for further high-performance nonvolatile memory applications.
关 键 词:charge trapping flash blocking layer STACK
分 类 号:TP333[自动化与计算机技术—计算机系统结构]
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