硅基体表面无钯活化化学镀镍工艺  

Palladium-Free Activation Process for Electroless Nickel Plating on Silicon Substrate

作　　者：马洪芳[1,2] 王艺涵[2] 邢振宁[2] 马芳[2] 丁严广[2] 

机构地区：[1]山东大学材料学院,山东济南250100 [2]山东建筑大学材料学院,山东济南250101

出　　处：《材料保护》2011年第10期48-50,8,共3页Materials Protection

基　　金：山东省博士后创新专项资金(200803049);山东省科技发展计划(2010G0020318);山东省自然科学基金(ZR2010EM062);济南市高校自主创新计划(201004048)资助

摘　　要：硅材化学镀镍的活化是为了获取金属原子沉积中心,但现有的活化工艺存在种种不足。金纳米粒子具有小尺寸效应、表面与界面效应,呈现出良好的催化活性。采用金纳米粒子对硅基体进行活化后化学镀镍,并采用浸泡腐蚀试验,SEM及EDS测试将其与传统的钯活化法对比,研究了活化后的沉积速度及镀层形貌、结构、耐腐蚀性能,结果表明:金纳米粒子活化法可提高沉积速度,所制备的镀层具有优良的耐蚀性,且更加致密均匀。Currently used activation process for electroless Ni plating has some drawbacks.Thus Au nanoparticles possessing small size effect,surface and interface effect and good catalytic activity were used to activate Si substrate subjected to Ni electroplating.The deposition rate,morphology,microstructure and corrosion resistance of resultant electroless Ni coating on Si substrate were investigated based on immersion corrosion test as well as scanning electron microscopic and energy dispersive spectrometric analysis while electroless Ni coating on Si substrate activated by Pd was used as a comparison.Results indicate that activation by Au nanoparticles helps to accelerate the deposition of electroless Ni coating and improve its compactness,uniformity and corrosion resistance.

关 键 词：硅 化学镀镍 活化 金纳米粒子 

分 类 号：TQ153.3[化学工程—电化学工业]