研磨方式对电瓷坯料粒度分布及性能的影响  

Effect of Grinding Methods on the Particle Size Distribution and Performances of Electrical Porcelain

作　　者：郭雁[1] 肖汉宁[1] 胡文华 

机构地区：[1]湖南大学材料科学与工程学院,长沙410082 [2]萍乡市华为电瓷电器科技有限公司,萍乡337200

出　　处：《硅酸盐通报》2011年第5期1131-1135,共5页Bulletin of the Chinese Ceramic Society

基　　金：国家自然科学基金(No.50972042)

摘　　要：比较了单一球磨(BM)和球磨与搅拌式砂磨相结合(BM+SM)两种研磨方法对电瓷坯料粒度分布及其性能的影响。用激光粒度分析仪测试了不同试样的粒度分布,用XRD和SEM表征了烧结试样的物相组成和显微结构。结果表明:球磨8 h后再经过搅拌式砂磨机研磨1 min的坯料特征粒度与球磨14 h的坯料特征粒度相比,D10和D50较为接近,但D90和D99均明显减小;球磨8 h后再砂磨1 min的坯料干坯强度提高了14%,烧成后瓷质抗弯强度和电气强度分别提高了约10%和8.5%,试样显微结构中晶粒尺寸较小,气孔率低且气孔尺寸较小,形状多呈规则的球状。The effects of single ball milling（BM） and ball milling combined with stirred bead milling（BM＋SM） on the particle size distribution and performances of electrical porcelain were compared.The size distribution of the slurry was tested by laser particle size analyzer.The phase composition and microstructure were characterized by XRD and SEM.Compared the particle size of ball milling for 8 h combined with stirred bead milling for 1 min（BM8＋SM） with that of single ball milling for 14 h（BM14）,D10 and D50 were similar,but both the D90 and D99 of BM8＋SM were significantly reduced relative to that of BM14.The dried strength of BM8＋SM was increased by 14% compared to BM14.The flexural strength and the electrical strength of BM8＋SM were enhanced by 10% and 8.5% respectively compared to those of BM14.The grain size of the sintered sample of BM8＋SM was smaller and the porosity was lower.The pore of BM8＋SM was smaller in size and more spherical in shape.

关 键 词：电瓷 搅拌式砂磨 粒度分布 机电性能 显微结构 

分 类 号：TQ174[化学工程—陶瓷工业]