低温下接触界面热阻的实验与模拟研究  

Simulation study on thermal boundary resistance between different metals at low temperature

作　　者：毕冬梅[1] 陈焕新[1] 王丽萍[1] 田野[1] 王惠龄[1] 

机构地区：[1]华中科技大学制冷及低温工程系,武汉430074

出　　处：《低温工程》2011年第5期46-49,55,共5页Cryogenics

基　　金：国家自然科学基金(50876034);中国科学院低温工程学重点实验室开放课题(CRY0201120)项目资助

摘　　要：在20—300 K和1.20—4.28 MPa范围内,分析温度和加载压力对铜-不锈钢接触界面热阻的影响,并进行回归分析和仿真研究。完全二次型模型与铜-不锈钢接触热阻实验结果吻合较好,最大相对误差为7%。仿真结果表明,在温度低于150 K时温度和压力的耦合对接触热阻的影响比较明显。Regression analysis and simulation research on thermal boundary resistance between copper and stainless steel were done in the temperature range of 20 K to 300 K and the loading pressure range of 1.20 MPa to 4.28 MPa.The relative error of regression model was less than 7%,and good accordance between simulation results and experiment data was found.It is found that the thermal boundary resistance decreases with the increasing of temperature and loading pressure under the experimental conditions.Investigation also shows that the coupling effects between temperature and loading pressure on thermal boundary resistance exist.

关 键 词：接触界面热阻 铜-不锈钢 耦合 

分 类 号：TB657[一般工业技术—制冷工程] TB663