铜基结合剂金刚石节块的烧结和性能研究  

Sintering and Properties Study of Cu-matrix Bonding Diamond Tool Bits

作　　者：肖长江[1] 栗正新[1] 邓相荣[1] 杨雪峰[1] 宋冬冬[1] 

机构地区：[1]河南工业大学

出　　处：《工具技术》2011年第10期24-26,共3页Tool Engineering

基　　金：河南省教育厅基金资助项目(2011A430008)

摘　　要：采用热压烧结的方法得到了铜基结合剂金刚石节块,研究了烧结温度和压力对节块性能的影响。实验结果表明:烧结温度对铜基结合剂金刚石节块的硬度和抗弯强度等力学性能影响显著;而烧结压力的影响则不是很明显;当烧结温度为700℃和烧结压力为20MPa时,节块有最佳的硬度和抗弯强度。此外,节块的应力应变关系表现出与金属和陶瓷不同的应力应变曲线。Cu-matrix bonding diamond tool bits were prepared by hot-pressing sintering. The effect of sintering temperature and pressure on properties of was investigated. The results showed that sintering temperature has significant effect on the hardness and flexural strength of Cu-matrix bonding diamond tool bits, while sintefing pressure has less effect on the bits properties. The optimal sintering technique was that the sintering temperature was 700℃ and the sintering pressure was 20 MPa. Moreover, the stress-strain diagram of Cu-matrix bonding diamond tool bits is neither metal nor ceramics material character.

关 键 词：铜基结合剂 金刚石节块 热压烧结 抗弯强度 硬度 

分 类 号：TG115.2[金属学及工艺—物理冶金]