Cu含量对Ag-Cu钎料钎焊透氧膜界面结构的影响  

Effect of Cu Content on Interface Microstructures of Oxygen-Permeable Membrane Brazed with Ag-Cu Brazing Filler

作　　者：王方[1] 张玉文[1] 丁伟中[1] 鲁雄刚[1] 

机构地区：[1]上海大学,上海市现代冶金及材料制备重点试验室,上海200072

出　　处：《稀有金属材料与工程》2011年第10期1832-1835,共4页Rare Metal Materials and Engineering

基　　金：国家高技术研究发展计划项目(2006AA11A189);上海市科委博士后资助项目(D10011009023)

摘　　要：采用Ag-Cu钎料用于透氧膜与不锈钢支撑体之间的封接,研究了Cu含量对Ag-Cu钎料钎焊透氧膜界面结构的影响。利用SEM对连接界面的显微组织进行观察,并用EDS对界面的相组成进行分析。结果表明:纯Ag与透氧膜陶瓷之间的连接界面无元素互扩散;Ag中少量1at%Cu的添加并未明显改善钎焊连接界面;当Cu含量增加到3.3at%时,在透氧膜一侧生成一层由Cu和Ag扩散所致的厚度约200μm的反应层,反应层的生成表明Ag-3.3Cu钎料与透氧膜之间具有良好的润湿性和界面结合。Ag-Cu brazing filler were adopted to seal oxygen-permeable membrane ceramics and stainless steel support,and the effect of Cu content on interface microstructure of oxygen-permeable membrane brazed with Ag-Cu brazing filler was investigated.The microstructure of the interface was observed by SEM and the constituent phases were analyzed by EDS.The results show that no elemental interdiffusion occurs in the interface of pure Ag and oxygen-permeable membrane;the addition of 1 at%Cu doesn＇t improve the bonding of the interface obviously;when the Cu content reaches 3.3 at%,a reaction layer of about 200 μm in thickness forms on the membrane side due to the diffusion of Cu and Ag,which indicates the good wetting ability and interface bonding between Ag-3.3Cu brazing filler and oxygen-permeable membrane.

关 键 词：Ag-Cu钎料 透氧膜 钎焊 界面结构 

分 类 号：TG454[金属学及工艺—焊接]