中温固化单组分EP结构胶的研究  

Study on one-component EP structure adhesive with moderate temperature curing

作　　者：艾静[1] 宁荣昌[1] 王青松[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国胶粘剂》2011年第10期45-48,共4页China Adhesives

摘　　要：利用超细微双氰胺固化剂与自制脲促进剂制成了单组分环氧树脂(EP)结构胶。研究结果表明:当w(促进剂)=1%、w(固化剂)=6%时,该EP结构胶可中温固化(125℃固化1 h),其室温储存期超过180 d;该EP结构胶经质量分数为20%的聚酰胺酰亚胺(PAI)增韧后,其T型剥离强度(1.30 kN/m)提高了8倍左右,25、150℃时的拉伸剪切强度为36.8、6.7 MPa,热分解温度大于300℃,说明其具有一定的耐温性能。An one-component EP（epoxy resin） structure adhesive was prepared by adding micronized dicyandiamide curing agent and self-made urea-aceelerant. The research results showed that the EP structure adhesive could be cured at moderate temperature（namely 125℃ for 1 h） ,and its storage period at room temperature was more than 180 d when mass fractions of aecelerant and curing agent were 1% and 6% respectively. The EP structure adhesive,which was modified by PAI （polyamide-imide） toughener with mass fraction at 20%,had higher mechanics strength and certain temperature resistance because the T-peeling strength（1.30 kN/m） of modified system was about 8 times more than that of unmodified system,its tensile shear strength was 36.8 MPa at 25 ℃ or 6.7 MPa at 150 ℃ ,and its temperature of pyrolysis was more than 300 ℃.

关 键 词：单组分 中温固化 环氧树脂 结构胶 聚酰胺酰亚胺 增韧 

分 类 号：TQ433.437[化学工程] TQ436.2