Fabrication and testing of phase change heat sink for high power LED  

大功率发光二极管相变热沉的制造及测试(英文)

作　　者：向建化[1] 张春良[1] 江帆[1] 刘晓初[1] 汤勇[2] 

机构地区：[1]广州大学机械与电气工程学院,广州510006 [2]华南理工大学机械与汽车工程学院,广州510640

出　　处：《Transactions of Nonferrous Metals Society of China》2011年第9期2066-2071,共6页中国有色金属学报（英文版）

基　　金：Projects(50436010,50930005)supported by the National Natural Science Foundation of China;Project(U0834002)supported by the Joint Fund of NSFC-Guangdong of China

摘　　要：A novel phase change heat sink was fabricated for packaging cooling of high power light emitting diode （LED）. 3D structures as enhanced boiling structure in the evaporation surface were composed of a spiral micro-groove along circumferential direction and radial micro-grooves which were processed by ploughing-extrusion （P-E） and stamping, respectively. Meanwhile, the cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. Operational characteristics were tested under different heat loads and refrigerants. The experimental results show that phase change heat sink is provided with a good heat transfer capability and the temperature of phase change heat sink reaches 86.8 ℃ under input power of 10 W LED at ambient temperature of 20 ℃.制造一种新型大功率发光二极管(LED)相变热沉作为封装级散热元件,采用犁切?挤压成形的周向螺旋状微沟槽和采用冲压成形的放射状径向沟槽组成的三维结构作为蒸发面强化沸腾结构,内壁采用铜粉颗粒烧结而成的毛细芯结构为工质提供循环动力。测试了相变热沉在不同输入功率和工质条件下的运行特性。结果表明,相变热沉具有良好的传热能力,在环境温度为20°C,输入功率为10W的条件下,相变热沉最高温度为86.8°C,可满足功率为10W的LED封装散热需求。

关 键 词：high power light emitting diode phase change heat sink enhanced boiling WICK heat transfer performance 

分 类 号：TN312.8[电子电信—物理电子学]