环氧树脂基导热绝缘复合材料的研究进展  

Progress in Epoxy-based Thermal Conductive Insulating Composites

作　　者：胡慧慧 李凡 李立群 

机构地区：[1]上海安美特铝业有限公司,上海200444

出　　处：《绝缘材料》2011年第5期27-30,共4页Insulating Materials

摘　　要：分析了环氧树脂基导热绝缘复合材料的导热机理,主要从填料的种类、粒径、用量、表面处理及复配等方面综述了环氧树脂基高导热绝缘复合材料的研究进展,并对环氧树脂基导热绝缘复合材料的应用前景及重点研究方向进行了展望。The thermal conduction mechanism of epoxy-based thermal conductive insulating composites was analyzed.The research progress of epoxy-based thermal conductive insulating composites was reviewed from aspects like the type,size,content,surface treatment and complex formulation of fillers.Finally the application and key research direction of the epoxy-based thermal conductive insulating composites were prospected.

关 键 词：环氧树脂 导热系数 导热机理 绝缘 

分 类 号：TM215.92[一般工业技术—材料科学与工程] TQ323.5[电气工程—电工理论与新技术]