Cu微网格修饰TiO_2薄膜的结构及性能  

Performance of TiO_2 thin Films Connected with Cu Micro-grid

作　　者：朱海玲[1] 

机构地区：[1]潍坊学院,山东潍坊261061

出　　处：《潍坊学院学报》2011年第6期41-44,共4页Journal of Weifang University

基　　金：山东省青年基金项目(ZR2010EQ001)

摘　　要：针对半导体光催化过程中光生载流子的复合问题,采用微球模板技术在TiO2薄膜表面制备了Cu微网格,分析了样品光催化性能随表面Cu负载量的变化。结果表明,与单纯TiO2薄膜相比,复合薄膜的光催化性能随Cu负载量增加有显著提高,是由于Cu微网格对TiO2薄膜表面光生载流子的分离和传输作用,有效提高了光催化过程中的量子效率。Aiming at reducing the recombination of photo--induced carriers in semiconductor photocatalytic process, we prepared TiO2 thin film with its surface modified by a connected Cu micro--grid via a mlcrosphere llthography strategy, which shows higher photocatalytic activity than the pure TiO2 film. The improvement of photocatalytic activity of Cu micro--grid to the TiO2 film is due to the charge carrier separation and electron transfer hy the conducting metal grid. The photocatalytic activity improved as metal loading increased, obtained the best performance at a certain loading amount, and then decreased at higher loading amount.

关 键 词：表面修饰 光催化 微网格 

分 类 号：O614.121[理学—无机化学]