热镀Galfan合金界面层的生长动力学研究  

Kinetics of interfacial layer during hot-dip Galfan alloy

作　　者：赵雪勃[1] 杜安[1] 吴海耀[2] 王凤华[1] 

机构地区：[1]河北工业大学材料科学与工程学院,天津300130 [2]天津大沽化工股份有限公司,天津300450

出　　处：《河北工业大学学报》2011年第5期70-73,77,共5页Journal of Hebei University of Technology

基　　金：河北省科技支撑项目(08275605D)

摘　　要：通过还原法制备不同浸镀时间的Galfan合金镀层样品,用SEM观察镀层的微观形貌,根据扫描图片测量界面层的厚度,拟合界面层厚度与时间的函数关系.实验结果表明,随着浸镀时间的延长,镀层的共晶组织越来越致密和均匀,界面层的厚度有增长的趋势.最后得出了界面层生长过程中形核阶段动力学方程和长大阶段的动力学方程.Hot-dip Galfan alloy coating at different exposure times were prepared by reduction. SEM was used to observe themicrostructureofGalfancoating. The thickness ofthe interfacial layer was measured according to scan images. Based on the results, the growth relations of the intermetallic layer at different exposure times were obtained by curve-fitting method. The results show that Galfan coating is denser and more uniform with increasing time. The formation ofinterfacial layer is divided into nucleation and growth. Finally, the dynamic equations of interracial layer growth are calculated during the nucleation stage and growth stage.

关 键 词：GALFAN合金 界面层 共晶组织 动力学 热浸镀 

分 类 号：TG174.44[金属学及工艺—金属表面处理]