用铜粉处理酸性镀铜溶液中的氯离子  

Treatment of Chloride Ion in an Acidic Copper Plating Bath with Copper Powder

作　　者：郭崇武 

机构地区：[1]肇庆市华良金属精饰制品有限公司,广东肇庆526105

出　　处：《涂装与电镀》2008年第6期31-32,共2页Painting and Electroplating

摘　　要：研究了用铜粉处理酸性镀铜溶液中氯离子的机理和方法,实验表明,向酸性镀铜溶液中加入铜粉,金属铜与Cu2+离子和氯离子反应生成氯化亚铜沉淀。用铜粉处理酸性镀铜溶液中的氯离子效果较好,向镀液中加铜粉1g/L,氯离子的去除率为58.9%,而向镀液中加锌粉1g/L,氯离子的去除率为36.8%。The mechanism and method for treating the chloride ion in an acidic copper plating bath with copper powder were studied. Experimental tests showed that, when the copper powder was added to the acidic copper solution, it reacted with Cu2+ and chloride ion to produce copper monochloride deposition. The chloride elimination rate was 58.9% after adding 1.0 g/L of copper powder to the acid copper solution, however, with the conventional method, the rate was 36.8% after 1.0 g/L of zinc powder was added to the solution. The results indicate that the use of copper powder to treat the chloride ion is more effective than using zinc powder.

关 键 词：酸性镀铜 氯离子 铜粉 处理 

分 类 号：TQ153[化学工程—电化学工业]