Electrodeposition and corrosion behavior of nanostructured Ni-TiN composite films  

纳米结构Ni-TiN复合薄膜的电沉积及腐蚀行为(英文)

作　　者：朱旭蓓[1] 蔡超[2,3] 郑国渠[1] 张昭[3] 李劲风[4] 

机构地区：[1]浙江工业大学化工学院,杭州310014 [2]西安交通大学材料强度国家重点实验室,西安710049 [3]浙江大学化学系,杭州310027 [4]中南大学材料科学与工程学院,长沙410083

出　　处：《Transactions of Nonferrous Metals Society of China》2011年第10期2216-2224,共9页中国有色金属学报（英文版）

基　　金：Projects(50771092,21073162) supported by the National Natural Science Foundation of China;Project(2005DKA10400-Z15) supported by the Ministry of Science and Technology of China

摘　　要：The Ni-TiN nanocomposite film was successfully electrodeposited on brass copper substrates.The microstructures of the Ni-TiN nanocomposite film were investigated using scanning electron microscopy（SEM） and transmission electron microscopy（TEM）.Its average grain size was analyzed through X-ray diffraction（XRD）,and its anti-corrosion property was studied through potentiodynamic scanning curves and electrochemical impedance spectroscopy（EIS）.The results show that the morphology of Ni-TiN composite film is sensitively dependent on the electroplating current density,TiN nanoparticle concentration,solution stirring speed,bath temperature and pH value of solution.The average grain size of the optimized nanocomposite film is about 50 nm.Meanwhile,the Ni-TiN nanocomposite films are much more resistant to corrosion than pure Ni coatings.采用电沉积方法在黄铜基底上制备纳米结构的Ni-TiN复合薄膜。用扫描电镜(SEM)及透射电镜(TEM)对其微观结构进行表征,利用X射线衍射(XRD)分析其平均晶粒尺寸,采用极化曲线及电化学阻抗谱(EIS)研究其腐蚀行为。结果表明,电沉积的电流密度、TiN纳米粒子的浓度、搅拌速度、溶液温度及pH值对电沉积薄膜形貌的影响较大。制备的Ni-TiNi电沉积薄膜的平均晶粒尺寸约为50nm。纳米结构的Ni-TiNi电沉积薄膜的耐腐蚀性能远优于纯Ni沉积薄膜的。

关 键 词：Ni-TiN nanocomposite film ELECTRODEPOSITION electrochemical impedance spectroscopy 

分 类 号：TB43[一般工业技术]