非接触式超精密研磨技术  

Non-Contact Ultraprecision Lapping-Investigation on Japanses Ultraprecision Machining Technology part 4

作　　者：吴明根[1] 

机构地区：[1]中国航空精密机械研究所

出　　处：《航空精密制造技术》1993年第2期11-12,共2页Aviation Precision Manufacturing Technology

摘　　要：名古屋工业技术研究所SP46型非接触式研磨机,研磨盘与工作轴以20～200r/min的转速作同向、高精度旋转,工作悬浮在研磨盘上,在研磨液的化学作用及微细粉末粒子的撞击下产生研磨作用。轴系皆采用液体动静压轴承,可加工Φ170mm的工件。该机可加工出表面粗糙度为2nm的硅片,加工Φ100mm、厚度为30mm的BK7光学玻璃,平面度为0031μm,表面粗糙度(均方根偏差)可达0.0038μm。特别适合微电子功能材料及光学平面的超精密加工,具有广阔的应用前景。The lapping disc and the work spindle of a SP 46 non-contact lapping machine at the Industrial Re- search Institute in Nagoya Japan accurately rotate at 20～200r/min in the same direction. The workpiece is floating on the lapping disc and lapped by chemical reaction of lapping liquid and hit from fine powder particles. Hydrostatic bearings are used at the shafting. Parts with diameter of 170mm can be lapped by the ma- chine. Silicone slices can be machined with roughness of 20nm, BK7 optical glass with diameter of 100mm, thickness of 30mm and flatness of 0.031μm can be worked, the roughness(deviation of rms)of which is 0.0038μm. The lapping machine is specially suitable for ultraprecision machining of microelectronic materials and optical flats. It will be widely used in the future.

关 键 词：非接触 超精密研磨 

分 类 号：V26[航空宇航科学与技术—航空宇航制造工程]