Cu^(2+)对软腐细菌(Erwinia carotovora subsp.carotovora Dye)致病因子的影响  

EFFECTS OF Cu^(2+) ON PATHOGENIC FACTORS OF ERWINIA CAROTOVORA SUBSP.CAROTOVORA(JONES)DYE

作　　者：张学君[1] 王金生[1] 方中达[1] 

机构地区：[1]南京农业大学植物保护学系

出　　处：《南京农业大学学报》1990年第S1期46-50,共5页Journal of Nanjing Agricultural University

基　　金：国家自然科学基金

摘　　要：在体外测定中,cu^(2+)浓度高于1.25ppm 时,所有的 StEcc-12菌体(10~6CFU/ml)均被杀死。在以聚半乳糖醛酸为唯一碳源的培养基中,Cu^(2+)浓度高于0.31ppm 时,该细菌不能生长。但较低浓度的 Cu^(2+)能使细菌胞外果胶裂解酶(PL)、果胶水解酶(PG)和蛋白酶的单位活性提高。在细菌胞外酶粗提液中加入2.54ppmCu^(2+)可以大大提高PL 的活性。用50ppm 硫酸铜处理接过菌的薯块可使其中活菌减少2个数量级,但残留下来的细菌仍能迅速繁殖,并导致薯块腐烂。硫酸铜渗透薯块后使各部位的组织含 Cu^(2+)量有不同程度的提高,而以皮孔组织最显著。Cu^(2+)的杀菌作用是减轻软腐病发生的主要原因。10~6 CFU/ml of StEcc-12 cells were killed by copper ion at a content of 1.25ppm orabove.Bacteria could not grow in MS media containing 0.31ppm or above of Cu^(2+)and0.5% of polygalacturonic acid as sole carbon source.The unit cell activity of extrocellularpectate lyases(PL),pectate hydrases(PG)and proteases were increased when a lower con-tent of Cu^(2+)was added to the medium.PL in enzyme extract was greatly activated by addi-tion of 2.54ppm Cu^(2+).After dipping in copper sulphate,bacterial population in tuber tis-sues was reduced by 10~2,but the survival cells could grow rapidly and induce soft rot.Cop-per contents in all tissues,especially in lenticel tissues,were increased by copper sulphatefiltration.It is suggested that copper ion inhibits soft rot mainly through killing thebacteria.

关 键 词：软腐细菌 致病因子 铜离子 

分 类 号：S[农业科学]