利用俄歇电子能谱确定Au-Cu系统的互扩散系数及晶界扩散系数  

DETERMINATION OF THE INTERDIFFUSION AND BOUNDARY DIFFUSION COEFFICIENTS OF THE Au-Cu SYSTEM BY AUGER ELECTRON SPECTROSCOPY

作　　者：刘友婴[1] 李望 展振宗 魏保安[3] 刘宝英 

机构地区：[1]南开大学电子科学系 [2]理化工程研究院 [3]天津一轻局职工大学

出　　处：《真空科学与技术学报》1990年第3期155-158,共4页Chinese Journal of Vacuum Science and Technology

基　　金：国家自然科学基金

摘　　要：本文利用俄歇电子能谱(PHI-550)测得了经过不同时间间隔热处理的Au-Cu系统中铜在金薄膜内的浓度剖面。根据铜的浓度斟面及Hall公式,我们使用了两种方法——“中心梯度法”及“平坦区上升法”计算出Au-Cu系统的互扩散系数以及晶界扩散系数。本文还对上述计算结果进行了讨论。In this paper the concentration profiles of copper in the gold thin film of the Au-Cu system after the heat treatment of different time-intervals have been measured by Auger electron spectroscopy (PHI 550). Based on the profiles of copper concentrations and Hall's formulae the interdiffusion coefficients of the Au-Cu system have been calculated by two methods, i. e., the 'center gradient method' and the 'plateau rise method', and the coefficients of grain boundary diffusion have been estimated as well. Discussions about the results have also been given in this paper.

关 键 词：互扩散系数 Au-Cu 晶界扩散 平坦区 俄歇电子 梯度法 时间间隔 溅射时间 晶粒尺寸 扫描方式 

分 类 号：TB7-55[一般工业技术—真空技术]