基于EBSD方法测定单晶Cu纳米压痕的各向异性实验  

Nano-Indentation Experiments on Anisotropy of Single Crystal Cu Oriented by EBSD Technique

作　　者：梁迎春[1] 盆洪民[1] 白清顺[1] 童振[1] 

机构地区：[1]哈尔滨工业大学机电工程学院,哈尔滨150001

出　　处：《纳米技术与精密工程》2011年第6期488-492,共5页Nanotechnology and Precision Engineering

基　　金：国家杰出青年科学基金资助项目(50925521);国家自然科学基金资助项目(50705023);哈尔滨工业大学科研创新基金资助项目(HIT.NSRIF.2009012)

摘　　要：为研究单晶Cu材料的各向异性力学特性,针对单晶连铸技术制备的单晶Cu,采用电子背散射衍射(EBSD)法对其3个不同晶粒的晶面进行定向,利用原位纳米压痕仪在不同晶面进行不同压入载荷的纳米压痕实验.通过EBSD分析,发现用单晶连铸技术制备的单晶Cu在拉拔方向上具有较强的择优取向,单个晶粒较大,且晶粒内部没有(亚)晶界存在.纳米压痕实验结果表明单晶Cu样件在各种压痕载荷下的约化模量为50 GPa～120GPa,材料的晶体取向对纳米压痕载荷-位移曲线和约化模量有很大影响,面(032)比面(119)和面(041)有更大的约化模量.不同载荷下,硬度值在0.8 GPa左右变动,晶体取向对硬度的影响较小.实验所得单晶Cu各晶面约化模量与采用金属弹性力学理论计算所得数值吻合较好.In order to investigate the anisotropic mechanical properties of single crystal Cu, nano-indentation experiments at three different crystal planes with various loads were done. The single crystal Cu was produced by the continuous casting technique, and its crystal planes were oriented by electron backscatter diffraction （EBSD）. By the analysis of EBSD data, it can be found that the single crystal Cu material presents an intensive preferred orientation in the drawing directions. The dimension of each crystalline grain is larger and no grain boundary or sub-boundary exists in its interior. Experimental results indicate that the value of reduced modulus at different loads is from 50 GPa to 120 GPa and crystal orientation shows an obvious effect on the reduced modulus and load-displacement curves of single crystal Cu. The reduced modulus of plane （032） shows a larger value than those of planes （119） and （041）. The indentation hardness values of single crystal Cu fluctuate around 0. 8 GPa at different loads, and the orientations seem to have an insignificant influence on hardness. Good agreement has been obtained on reduced modulus with three different crystal planes between the experimental results and the theoretical results calculated by metal elastic theory.

关 键 词：单晶Cu 电子背散射衍射 纳米压痕 晶体取向 约化模量 

分 类 号：TG115.5[金属学及工艺—物理冶金]