Thermal Warpage Measurement of Electronic Packages by Shadow Moiré with Phase Stepping Technique  

作　　者：王银燕 

机构地区：[1]Nokia Siemens Networks公司技术总监部门

出　　处：《实验力学》2011年第5期556-564,共9页Journal of Experimental Mechanics

摘　　要：Phase-stepping technique is applied to the analysis of fringe patterns of shadow moiré of electronic packages.Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased.Thermally induced warpage of electronic packages is successfully measured in real-time as the sample is driven through a simulated reflow process.The paper discusses the technique of phase stepping,noise filtering and its application to the shadow moiré method.Applications of the technology are presented.Phase-stepping technique is applied to the analysis of fringe patterns of shadow moirfi of electronic packages. Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased. Thermally induced warpage of electronic packages is successfully meastlred in real-time as the sample is driven through a simulated reflow process. The paper discusses the technique of phase stepping, noise filtering and its application to the shadow moire method. Applications of the technology are presented.

关 键 词：英文摘要 内容介绍 编辑工作 期刊 

分 类 号：G255.2[文化科学—图书馆学]