真空辅助RTM用环氧树脂成型工艺研究  

Study on the molding process of epoxy resin for vacuum-assisted RTM

作　　者：张旸[1,2] 张彦飞[1,2] 王香[3] 姚振兴[3] 刘亚青[1,2] 

机构地区：[1]中北大学山西省高分子复合材料工程技术研究中心,山西太原030051 [2]中北大学材料科学与工程学院,山西太原030051 [3]中北大学经济与管理学院,山西太原0330051

出　　处：《热固性树脂》2011年第6期44-48,共5页Thermosetting Resin

基　　金：山西省科技创新计划(2009101004)

摘　　要：对环氧树脂LT-5078体系进行了粘度-温度、粘度-时间测试,研究了其粘度特性,通过动态DSC法测定了树脂的固化反应热,并通过外推法得到其特征固化温度和成型工艺条件。实验表明,LT-5078的凝胶温度、固化温度、后处理温度分别为42℃、102℃、185℃,固化工艺为25℃×24 h+120℃×4 h。该树脂25℃时由初始粘度250 mPa.s上升到800 mPa.s所用时间为170 min左右,常温下有较长的低粘度时长,适合真空辅助RTM成型。The viscosity properties of epoxy LT-5078 system were investigated by the viscosity-temperature and viscosity-time testings.The curing reaction heat of the resin was determined by dynamic DSC and the characteristic curing temperature and molding process conditions were obtained by extrapolation method.The results showed that the gel temperature,curing temperature,post-treatment temperatures of LT-5078 were 42 ℃,102 ℃ and 185 ℃,respectively.The curing process was at 25 ℃ for 24 h and then at 120 ℃ for 4 h.The time of the resin from the initial viscosity 250 mPa · s up to 800 mPa · s at 25 ℃ was about 170 min.The resin had long time with low viscosity at room temperature and was suitable for vacuum-assisted RTM molding.

关 键 词：真空辅助RTM 环氧树脂 流变性 固化工艺 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]