浇注温度对Cu/Ni水套材料界面结合特性的影响  

Effects of Pouring Temperature on Interface Bonding Properties of Cu/Ni Water Jacket Material

作　　者：周毅[1] 谭伟[1] 张卫文[1] 罗宗强[1] 李元元[1] 

机构地区：[1]华南理工大学机械与汽车工程学院国家金属材料近净成形工程技术研究中心,广东广州510640

出　　处：《铸造技术》2011年第11期1560-1564,共5页Foundry Technology

摘　　要：利用固-液复合法制备了一种预埋纯镍管的新型Cu/Ni水套材料,采用金相、扫描电镜、显微硬度和剪切强度测试,重点分析不同浇注温度下铸铜水套材料的基体与预埋镍管的界面结合特性,如界面原子扩散行为、显微硬度、结合强度等。结果表明,在1 100℃、1 200℃和1 300℃3个浇注温度下,随着浇注温度的升高,界面处扩散层厚度增加,显微硬度增大;当浇注温度过高(1 300℃)时,镍管表面易于附着铜基体中析出的微小气孔,降低界面的结合强度,在1 200℃浇注温度下获得了约为162MPa的最佳界面剪切强度。A new type of Cu/Ni water jacket embedded pure nickel tube was prepared by sand casting. The interface bonding properties between the matrix and the embedded nickel tube at different pouring temperatures were mainly analyzed by OM, SEM, micro-hardness testing and shear strength testing,such as interface atomic diffusion, micro-hardness, bond strength, etc. The results show that the thickness of interface diffusion layer and micro-hardness increase with the increase of pouring temperature from 1 100℃ to 1 300℃. When the pouring temperature is as high as 1 300℃, there are many tiny pores attached to the surface of the nickel tube, which leads to the decrease of the interface bonding strength. The best interface shear strength about 162 MPa was obtained when the pouring temperature is 1 200℃.

关 键 词：铜水套 浇注温度 结合界面 冶金结合 

分 类 号：TG244[金属学及工艺—铸造]